SiC, GaN and power devices
Threshold voltage, leakage, conduction behavior, TID pre-stress and selected coupled-stress studies.
中文Request a testDEVICE PROGRAMS
Verification paths for devices and applications
X-ray TID addresses cumulative ionizing effects. It does not reproduce the complete space environment or replace SEE, proton, neutron-displacement or heavy-ion testing.
PROGRAM MATRIX
Start from the engineering risk
A device category is only the starting point. Bias state, operating mode, temperature, measurement timing and acceptance logic determine the useful test matrix.
FPGA, ASIC and SoC
Functional state, interfaces, timing, configuration retention and system-level behavior.
Memory devices
Data retention, read/write stability, error behavior and recovery characteristics.
CMOS image sensors
Dark current, noise, defect growth, response uniformity and imaging performance.
PMICs and power electronics
Output stability, conversion efficiency, protection behavior and parameter drift.
Wafers, dies and modules
Research-oriented evaluation across wafer, bare-die, packaged-device and module levels.
PROJECT INTAKE
Start with the engineering question
Share a non-sensitive device category, test objective, target dose, bias conditions and schedule. We will route the request to the appropriate specialist.